Breadboards are great and so are protoboards that are based on breadboard layouts. Well most of the time . They both have problems when you need to use IDC connectors, dual row headers or any other component that has 2 rows of connectors on a 0.1" (2.54mm) grid. The problem is due to the fact, that you need the connectors on each row to connect to a different terminal strip or protostrip. This cannot be done because each set of terminal strips/protostrips is separated by a 0.3" (7.62mm) gap.
This prototyping board addresses this problem by having an area on one edge of the board, specifically for IDC connectors and dual row headers. The rest of the board is based on a standard breadboard layout which makes it easy to transfer your designs from a breadboard to a more permanent form. Because of its form factor, it can be stacked with other small, medium and large protostack boards.
|Size:||5" x 3.7" (127 x 93.98mm)|
|Mounting Holes:||6 x 0.125" (3.175mm)|
|Component Holes:||1674 x 35mil (0.9mm)|
|Component Hole Pitch:||0.1" (2.54mm)|
|Pad Treatment:||Immersion Tin|
|Copper Thickness:||1oz per sqr foot|
|Track Width:||60 mil|
Features & Benefits
Based on a Breadboard Layout
This board is based on a standard breadboard with a few of our own improvements.
- Power busses are pre routed on the board
- Power busses go from edge to edge and do not have any gaps
- Power busses are available in the gap were DIL components usually sit. This provides more flexibility for component placement
and allows for more options for connecting power to components.
Screen Printing on Topside
Screen printing on the board top clearly shows power busses and connection points. Positive power rails are marked with a thick band of white while the ground rails are marked with an outline.
Connection Strips on Top and Bottom Edges
All Protostack prototyping boards have sets of 3 connected pads on the top and bottom edges. These are used to interface each
board with the adjoining board above/below or to interface the board with an external system.
Standard Protostack Form Factor and Mounting Holes
Protostack large boards have a standard size with 6 mounting holes on the top and bottom edges. This allow the board
to be stacked with other small, medium or large boards using hexagonal spacers.
Immersion Tin Pad Treatment
This is a premium lead-free treatment which protects the copper tracks from oxidation
and make it easier to solder.
All holes are thru-plated to improve strength and solderability. Not only does this provide a greater surface area for the solder to stick to, the capillary action makes soldering so easy.
On all board areas except the solder pads a polymer based mask is applied. This is a common practice on production PCBs but less common on prototyping boards. The solder resist prevents bridging between tracks and make soldering easier.
Quality FR4 Board Material
We use quality FR4 fibreglass board material unlike the paper based phenolic material that is found in many prototyping boards.
Fibreglass reinforced substrates have a much higher strength that paper reinforced boards and are more resistant to cracking or breaking.
Dual row and IDC Support
On one edge of the board there is an area specifically designed to support dual row devices.